The signal chain modules use a System-in-Package (SiP) technology similar to multi-chip modules (MCM) to integrate components with different technologies along with passive components to make an integrated subsystem. The micromodule (µModule) receivers consist of high-performance, high-speed ADCs with fixed-gain, high-speed amplifiers and anti-alias filters. The integrated ADC + driver products include integrated bypass capacitance and simplify the high frequency layout required to preserve the AC performance. The board space savings are significant for instrumentation applications such as spectrum analyzers, oscilloscopes (oscillographs) and communications test equipment or for communications applications such as high sensitivity receivers, software defined radio (SDR) or signal intelligence receivers.
For more information on the LGA package, please refer to...
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